| Summary: |
Senior Manufacturing Process Engineer |
| Responsibilities: |
Process development and monitoring
for a variety of back end chip processes that include
silicon wafer thinning, sawing, pick& place,
eutectic die bonding, gold wedge bonding, solder
and epoxy sealing. |
| Requirements: |
Experience in assembly. Educational background
in Material science, mechanical or electrical engineering.
BS minimum |
| Fax: |
310-606-0865 (Attn: HR - Job Code
05-08) |
| Addtl Info: |
This is a full time position with competitive
salary and full benefits package. |