Assembly Process Engineer
Integra Technologies, an industry leading supplier of high-performance semiconductor transistor power solutions, is seeking an Assembly Process Engineer with experience in back-end assembly and manufacturing processes to join our team. Working together with our cross-functional engineering teams in a world class, fully integrated design and manufacturing environment, this individual will enjoy a broad range of responsibilities ranging from developing new products - from concept to production - to supporting our many market leading products already in production and being deployed into radar systems around the world.
Duties and Responsibilities
Developing and implementing back-end hybrid assembly processes, die mounting, wire bonding, and sealing) for high power RF transistors in a high mix production environment
Partner with internal design engineering groups throughout the product development cycle to define new processes that allow for successful transition of new products to manufacturing.
Bring on new external partner collaborations as needed
Creating and writing process specifications and procedures, updating process documentation as required
Drive continuous improvement of manufacturing operations
Provide technical leadership and guidance to production operations to troubleshoot production issues, coordinating and implementing corrective actions
Support the implementation of Lean manufacturing methods to increase production efficiencies and reduce costs
Ensure cleanroom production areas comply to standards
Qualifications and Requirements
BS, MS or PhD in Mechanical Engineering, Electrical Engineering, or Physics
3 - 5 years of demonstrated hands-on experience with Semiconductor backend processes in a production cleanroom environment
3 - 5 years of experience with hybrid assembly processes such as die mounting, wire bonding, epoxy and hermetic sealing
Experience in new product introduction and implementation of continuous improvements on existing products utilizing a strong understanding of manufacturing engineering
Trained in Lean, Six Sigma, and/or other structured problem-solving techniques
Experience with SPC methodologies and data tools
Demonstrated project leadership capabilities, excellent written and verbal communication skills
US Citizenship or Permanent residency required
Pay Range
$75,000 - $90,000 per year, depending upon experience
