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Integra Discusses Solutions for the Challenges in Upgrading TWTs with RF Globalnet at IMS

2018 թ. հունիսի 2, շաբաթ

Integra Technologies lead engineer, Apet Barsegyan interviewed with RF Globalnet at the International Microwave Symposium, June 2018 in Philly to discuss solutions for the challenges in upgrading current TWTs in high-power radar & pulsed applications to the newest solid-state GaN HEMT tech.

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